考察一个在热循环中的表面贴片电阻。一般情况下，连接贴片电阻与电极的焊点是其中最薄弱的环节，它通常对温度和时间表现出较强的非线性。为了确保结构的完整性，基于蠕变应变和耗散能进行了疲劳分析。-This case study of a surface patch resistance in a thermal cycle. In general, the solder joint is the weakest link, which usually shows strong nonlinearity in temperature and time. In order to ensure the integrity of the structure, the fatigue analysis is carried out based on the creep strain and dissipation energy.