cadence软件下自作的焊盘文件，常用的器件的封装，包括了0805 0603 1206 1608 vga 排阻，插针等器件-cadence software, made under the self-pad file, commonly used in the device package, including 0805 0603 1206 1608 vga exclusion, pins and other devices。

cadence of the learning process via pad production