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Bluetooth_Core_Specification_v1[1].2
- 蓝牙核心规范,涵盖了从物理层,链路层到HCI层的各层协议.-Bluetooth Core Specification, covering from the physical layer, link layer to the HCI protocol layer on each floor.
iWRAP_Update_Client
- how to use the bluetooth module in the HCI layer
SouthKorea101007
- 蓝牙模块\蓝牙芯片ROK 101 007在蓝牙语音系统中的应用,单片机通过HCI指令驱动-Bluetooth modules \ Bluetooth chip, South Korea 101 007 in the Bluetooth audio system, the application of order-driven microcontroller through the HCI
9301_ds_0
- EM9301超低功耗蓝牙控制芯片demo设计资料以及HCI控制指令-EM9301 ultra-low power consumption bluetooth control chip design data