文件名称:test
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- 上传时间：2012-11-16
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文件大小：305.04kb
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硅压阻式智能压力传感器，基于最小二乘法温度补偿，基于PIC16F876单片机-Silicon Piezoresistive Smart pressure sensors, temperature compensation based on the least-squares method, based on PIC16F876 microcontroller
(系统自动生成,下载前可以参看下载内容)
下载文件列表
test/eeprom.c
test/spi.p1
test/eeprom.pre
test/main.c
test/main.p1
test/main.pre
test/pic1687x.h
test/pressure sensor.c
test/pressure sensor.p1
test/pressure sensor.pre
test/RC5.c
test/RC5.p1
test/RC5.pre
test/spi.c
test/spi.h
test/tcomp.p1
test/spi.pre
test/startup.as
test/startup.obj
test/tcomp.c
test/tcomp.h
test/eeprom.p1
test/tcomp.pre
test/test.c
test/xunhuan.pre
test/xunhuan.p1
test/test.sdb
test/test.lst
test/test.rlf
test/test.mcp
test/test.mcw
test/malloc.h
test/test.p1
test/test.pre
test/xunhuan.c
test/xunhuan.h
test/test.obj
test/usart.c
test/usart.h
test/test.map
test/usart.pre
test/test.mcs
test/test.sym
test/test.hex
test/test.hxl
test/test.cof
test/test.lde
test/usart.p1
test
test/spi.p1
test/eeprom.pre
test/main.c
test/main.p1
test/main.pre
test/pic1687x.h
test/pressure sensor.c
test/pressure sensor.p1
test/pressure sensor.pre
test/RC5.c
test/RC5.p1
test/RC5.pre
test/spi.c
test/spi.h
test/tcomp.p1
test/spi.pre
test/startup.as
test/startup.obj
test/tcomp.c
test/tcomp.h
test/eeprom.p1
test/tcomp.pre
test/test.c
test/xunhuan.pre
test/xunhuan.p1
test/test.sdb
test/test.lst
test/test.rlf
test/test.mcp
test/test.mcw
test/malloc.h
test/test.p1
test/test.pre
test/xunhuan.c
test/xunhuan.h
test/test.obj
test/usart.c
test/usart.h
test/test.map
test/usart.pre
test/test.mcs
test/test.sym
test/test.hex
test/test.hxl
test/test.cof
test/test.lde
test/usart.p1
test
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