本文阐述了利用红外热像仪对电子设备关键部位进行热测试，检测电子设备内部温度分布情况，并与设计目标进行比较与纠正，从而达到最终目的-In this paper, using thermal infrared imager on the key parts of electronic equipment, thermal testing, testing the internal temperature distribution of electronic equipment, and compared with the design goals and corrected, so as to achieve the ultimate goal