文件名称:5385126
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这份资料价值极高,主要是关于DP/PA耦合器的一种新的开发方法,对于软件编程、单片机及总线知识要求很高,不管怎样这样的资料网上极少,是从IEEE辛苦找到的。-The foreign DP/PA coupler is realized by SIM1+
MCU chip,with a large number of procedures and codes
completed by the software, which is very complicated, and
technology is confidential. The paper puts forward a design
method that we use the smart agreement chip SPC3 and SPC4 as
the core to realize the function of the coupler, and use AT89S52
single-chip to control them. These chips are integrated of DP/PA
agreement ,so it is easier to achieve. And according to this
design, we build the hardware, and complete the connection of
DP and PA slave respectively in the laboratory. In addition
through programming in Keil compiler environment, we
accomplish the initialization of SPC3 and SPC4, interrupt
handling, as well as DP/PA slave communication test. The
experiment shows that the program achieves a satisfactory effect
and we try to isolate transmission signal and 3.3V/5V power
supply.
KEYWORDS: DP
MCU chip,with a large number of procedures and codes
completed by the software, which is very complicated, and
technology is confidential. The paper puts forward a design
method that we use the smart agreement chip SPC3 and SPC4 as
the core to realize the function of the coupler, and use AT89S52
single-chip to control them. These chips are integrated of DP/PA
agreement ,so it is easier to achieve. And according to this
design, we build the hardware, and complete the connection of
DP and PA slave respectively in the laboratory. In addition
through programming in Keil compiler environment, we
accomplish the initialization of SPC3 and SPC4, interrupt
handling, as well as DP/PA slave communication test. The
experiment shows that the program achieves a satisfactory effect
and we try to isolate transmission signal and 3.3V/5V power
supply.
KEYWORDS: DP
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