本研究项目针对手机、 M P4 等便携式电子产品对 I C芯片的高密度封装需求, 采用最新的国家发

明专利 ‘裸芯片积木式封装方法’, 将在同一块印制板上的集成电路裸芯片像积木一样挤紧嵌入在

PC B中, 用半导体光刻工艺进行芯片间以及芯片和 PC B间的直接平面互连, 完成电子整机板的制造过

程。 采用该方法可使电子整机芯片模板的体积缩小 5 到 20 倍。 本文对该项专利发明的研究内容、 技术

创新点、 工艺实施方案及典型应用等进行了较详细的介绍。-The research project for mobile phones, M P4 and other portable electronic products on the IC chip, high-density packaging needs, the latest national patent ' bare-chip packaging method building blocks' , will be on the same integrated circuit on the PCB, like die Like squeezing blocks embedded in the PC B, the use of lithography for semiconductor chip and between chips and PC B flat interconnection between the direct, complete e-machine board manufacturing process. Electronic machine using this method can reduce the chip size of the template 5 to 20 times. This paper studies the content of the patented invention, technical innovation, technology implementation plan and typical applications for a more detailed introduction.