资源列表
CLRC663
- NXP CLRC663数据手册,支持ISO14443/ISO18092/ISO15693-The NXP CLRC663 data manuals, support ISO14443/ISO18092/ISO15693 to
MCUPSelectionPChart-JuneP2012
- ST公司 STM32单片机 和STM8 单片机选型文档,适合工程师参阅!-ST company STM32 microcontroller STM8 microcontroller Selection documentation, for engineers see!
hand-gesture
- This is an abstract for an algorithm for hand gesture operation.
About-HongWai
- 一份很好的关于红外说明的文章,详细说明了红外的原理和技术实现。-A good article on IR explained, detailed descr iption of the realization of the principles and techniques of infrared.
HongWai-theory
- 关于红外通信的原理性的东西,非常有用。主要讲述了红外通信的编程方面的知识,希望对你有用。-The principle of the thing on the infrared communication, is very useful. Mainly about the infrared communication programming knowledge, you want to be useful.
load3ds
- 读取3D数据,使用C++进行编程,其中如果需要其他的代码,请留言-Read 3D data, use C++ programming, which, if you need other code, please leave a message
ANALYTIC-HIERARCHY-PROCESS
- 使用图例讲解层次分析法,方法简单易懂,便于理解和初次使用-Use the legend explain the Analytic Hierarchy Process, straightforward
AHP-calculate-weight
- 简明扼要介绍层次分析法使用方法及注意事项,有利于初学者学习-Use methods and precautions concise introduction Analytic Hierarchy Process, beneficial for beginners to learn
K-means-update
- 简明扼要介绍k均值算法使用方法及注意事项,有利于初学者学习-A concise introduction to the use of methods and precautions k-means algorithm, beneficial for beginners to learn
guashen
- 跑跑卡丁车补助全自动注入12345678-Running fully automatic injection
project-code
- data mining psokmeans algorithm
信号反弹作用下的3D-SIC过硅通孔的测试结构
- 3d sic三维堆叠集成电路(3D-SIC)主要采用过硅通孔技术来实现模块在垂直方向上的互连,但是硅通孔在制造过程或绑定后阶段都有可能出现失效,导致整个芯片无法正常工作。我们针对绑定后阶段硅通孔,利用信号在导体中传输的不可逆性,在信号接收端增加反弹模块,通过在发送端施加两次不同测试激励,利用触发器和多路选择器将两次输出结果进行异或,来达到测试目的。在4x4硅通孔逻辑块中,硅通孔单元面积是45x45um2,180nm CMOS工艺下,实验结果表明,测试结构面积和测试平均功耗分别减少59.8%和18