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采用多种测温元件的3通道闭环温度控制系统设计
电子工程第一、二阶段设计的小型温度控制系统的基础上采用3种测温元件同时对3个温度控制执行部件实施闭环温度控制,控温范围:0℃-100℃。3种测温元件分别为铂电阻温度传感器pt100、T型热电偶测温传感器和数字式一线温度计DS18B20。温度控制执行部件为半导体制冷片。对比电子工程设计第1、2阶段已经完成的温度控制系统,该项目工作内容的不同之处在于:为新采用的测温元件设计信号处理电路和数据采集方法,增加2个模/数转换通道和3个数/模转换通道的设计。-Using a variety of temperature measurement element 3 channel closed-loop temperature control system design
Electronic engineering first, using three kinds of temperature measurement devices designed for basic two-stage temperature control system on smaller while three temperature control execution unit to implement a closed-loop temperature control, temperature range: 0 ℃-100 ℃. Three kinds of temperature measurement devices are platinum resistance temperature sensor pt100, T-type thermocouple temperature sensor and digital line thermometer DS18B20. Temperature control execution unit for semiconductor refrigeration tablets. Contrast electronic engineering design phase has been completed the first and second temperature control system, the difference lies in the content of the project: for temperature measurement devices designed signal processing circuit and a new data collection method used to increase the two analog/digital converter channels and three the number of D/A converter c
电子工程第一、二阶段设计的小型温度控制系统的基础上采用3种测温元件同时对3个温度控制执行部件实施闭环温度控制,控温范围:0℃-100℃。3种测温元件分别为铂电阻温度传感器pt100、T型热电偶测温传感器和数字式一线温度计DS18B20。温度控制执行部件为半导体制冷片。对比电子工程设计第1、2阶段已经完成的温度控制系统,该项目工作内容的不同之处在于:为新采用的测温元件设计信号处理电路和数据采集方法,增加2个模/数转换通道和3个数/模转换通道的设计。-Using a variety of temperature measurement element 3 channel closed-loop temperature control system design
Electronic engineering first, using three kinds of temperature measurement devices designed for basic two-stage temperature control system on smaller while three temperature control execution unit to implement a closed-loop temperature control, temperature range: 0 ℃-100 ℃. Three kinds of temperature measurement devices are platinum resistance temperature sensor pt100, T-type thermocouple temperature sensor and digital line thermometer DS18B20. Temperature control execution unit for semiconductor refrigeration tablets. Contrast electronic engineering design phase has been completed the first and second temperature control system, the difference lies in the content of the project: for temperature measurement devices designed signal processing circuit and a new data collection method used to increase the two analog/digital converter channels and three the number of D/A converter c
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