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for the first time, the impact of hotcarrier-induced gate capacitance variation on dynamic circuits
in a VLSI chip. To investigate the mismatch drift due to the
hot-carrier-induced gate capacitance variation, internal probing
was performed at room temperature using an electron-beam
prober before and after stre- for the first time, the impact of hotcarrier-induced gate capacitance variation on dynamic circuits
in a VLSI chip. To investigate the mismatch drift due to the
hot-carrier-induced gate capacitance variation, internal probing
was performed at room temperature using an electron-beam
prober before and after stress
in a VLSI chip. To investigate the mismatch drift due to the
hot-carrier-induced gate capacitance variation, internal probing
was performed at room temperature using an electron-beam
prober before and after stre- for the first time, the impact of hotcarrier-induced gate capacitance variation on dynamic circuits
in a VLSI chip. To investigate the mismatch drift due to the
hot-carrier-induced gate capacitance variation, internal probing
was performed at room temperature using an electron-beam
prober before and after stress
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下载文件列表
2/01266626.pdf
2/01525138.pdf
2/04374135.pdf
2/04480153.pdf
2/04749312.pdf
2/05067047.pdf
2/05109519.pdf
2/05361327.pdf
2/06473869.pdf
2/06476051.pdf
2/06482203.pdf
2/06484218.pdf
2/06510478 (1).pdf
2
2/01525138.pdf
2/04374135.pdf
2/04480153.pdf
2/04749312.pdf
2/05067047.pdf
2/05109519.pdf
2/05361327.pdf
2/06473869.pdf
2/06476051.pdf
2/06482203.pdf
2/06484218.pdf
2/06510478 (1).pdf
2
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