文件名称:pdk10_imx27_WinCE60_UG
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i.MX27 PDK 1.0 Windows Embedded CE 6.0
User s Guide.This user’s guide describes the Freescale i.MX27 3-Stack Windows Embedded CE 6.0 board support package (BSP). The i.MX27 3-Stack reference board is designed for video and voice over Internet phones (V2IP), cordless and mobile phones, point-of-sale terminals, and other embedded industrial and medical applications.
This document explains how to install the BSP and use Microsoft Platform Builder for Windows Embedded CE 6.0 to build, download, and debug OS images. It also explains configuration and features. This document is intended for Microsoft Platform Builder users who want to build and execute Windows Embedded CE 6.0 OS images based on the Freescale i.MX27 3-Stack BSP.
User s Guide.This user’s guide describes the Freescale i.MX27 3-Stack Windows Embedded CE 6.0 board support package (BSP). The i.MX27 3-Stack reference board is designed for video and voice over Internet phones (V2IP), cordless and mobile phones, point-of-sale terminals, and other embedded industrial and medical applications.
This document explains how to install the BSP and use Microsoft Platform Builder for Windows Embedded CE 6.0 to build, download, and debug OS images. It also explains configuration and features. This document is intended for Microsoft Platform Builder users who want to build and execute Windows Embedded CE 6.0 OS images based on the Freescale i.MX27 3-Stack BSP.
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pdk10_imx27_WinCE60_UG.pdf
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