CDIP-----Ceramic Dual In-Line Package

CLCC-----Ceramic Leaded Chip Carrier

CQFP-----Ceramic Quad Flat Pack

DIP-----Dual In-Line Package

LQFP-----Low-Profile Quad Flat Pack

MAPBGA------Mold Array Process Ball Grid Array

PBGA-----Plastic Ball Grid Array

PLCC-----Plastic Leaded Chip Carrier

PQFP-----Plastic Quad Flat Pack

QFP-----Quad Flat Pack

SDIP-----Shrink Dual In-Line Package

SOIC-----Small Outline Integrated Package

SSOP-----Shrink Small Outline Package-CDIP-----Ceramic Dual In-Line Package　

CLCC-----Ceramic Leaded Chip Carrier　

CQFP-----Ceramic Quad Flat Pack　

DIP-----Dual In-Line Package　

LQFP-----Low-Profile Quad Flat Pack　

MAPBGA------Mold Array Process Ball Grid Array　

PBGA-----Plastic Ball Grid Array　

PLCC-----Plastic Leaded Chip Carrier　

PQFP-----Plastic Quad Flat Pack　

QFP-----Quad Flat Pack　

SDIP-----Shrink Dual In-Line Package　

SOIC-----Small Outline Integrated Package　

SSOP-----Shrink Small Outline Package