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2440WINCE500BSP
- 三星2440 cpu WINCE 5.00板级支持包-5.00 cpu WINCE Board Support Package
XSCALE
- 嵌入式操作系统VxWorks中板级支持包文件-Embedded operating system VxWorks Board Support Package documents
s3c2410的BSP包
- BSP是Board Support Package的缩写，该术语通常用于嵌入式领域，主要指在开发嵌入式应用时系统开发商提供的各种驱动支持库。不过该术语即使在嵌入式领域人们对它的理解也有一些不同，有的认为它就是驱动程序，有的认为它是OS的驱动程序，也有认为它就是HAL（HardWare Abstract Layer ）。实际上这几种理解都只是侧重于某个部分，再由于每个嵌入式系统提供商都根据自己的系统而提出对BSP的不同理解，因此在涉及到BSP的具体涵义时人们往往有一种似是而非的感觉。嵌入式系统提供
WinCE_BootLoader_develop.rar
- 介绍了WinCE系统下BootLoader的开发基本过程 CE并不是一个通用的安装版操作系统，在形形色色的嵌入式硬件设备世界里， 一款CE系统通常只会针对某一种硬件平台生成。所以，作为原始设备生产商，必须根据自己的硬件平台和应用场合定制CE，最主要的工作就是编写适合于自己的板级支持包（BSP）。在BSP中，包含了一个重要的组成部分——BootLoader。创建一未功能完善的BootLoader，是开发WinCE系统的第一步，也是极为关键的一步。本文将结合开发实例，介绍如何开发适合于自己硬件的B
twrk70f120m
- This is MQX 3.8 Board Support Package for Kinetis K70 - TWR-K70F120 hardware board. Details at freescale.com.
VxWork
- VxWorks操作系统板级支持包的设计与实现-Operating system VxWorks Board Support Package Design and Implementation
vxworks_bsp_developers_guide_6.6
- VxWorks 6.6 BSP开发执导 This document describes, in general terms, the elements that make up a board support package [BSP], the requirements for a VxWorks BSP, and the general behavior of a BSP during the boot process. This document outlines the
gumstixiii-16879
- This is a Windows CE 6.0 Board Support Package for the Gumstix Verdex platform
ucos_CORTTEX
- ucos2.86版本结合STM板极支持包-combination of STM version ucos2.86 board support package
WinCE_BootLoader
- 摘要：介绍WinCE.NET系统的旧方法；说明板级支持包（BSP）的基本构成；从开发实际出发，详细阐述如何开发BSP中的重要部件--BootLoader-Abstract: This paper describes the old method WinCE.NET system Help Board Support Package (BSP) of the basic component from the development of the reality of BSP in detail
pdk10_imx27_WinCE60_UG
- i.MX27 PDK 1.0 Windows Embedded CE 6.0 User s Guide.This user’s guide describes the Freescale i.MX27 3-Stack Windows Embedded CE 6.0 board support package (BSP). The i.MX27 3-Stack reference board is designed for video and voice over Internet phone
ARMCP1136JF-S-WINDOWSCE500-r0p0-00alp0
- WindowsCE BSP 5.0 for ARM Integrator CP 926/1136 ------------------------------------------------ Windows CE 5.0 Board Support Package for ARM Integrator CP 926/1136 Platform
UserGuide_BSP2.3_for_IA_platforms-WinCE50_60
- Platform Support Package (PSP) for Microsoft Windows* CE 5.0 and 6.0 supporting Intel Chipsets
bsp
- 简单的介绍了vxworks操作系统下的bsp——板级支持包的开发过程。-A brief introduction of the vxworks operating under the bsp- Board Support Package development process.
s3c-linux-2.6.16
- Samsung high-end mobile application processor S3C6400 series Linux Board support package.
EBOOT
- 6410板级开发支持包的eboot源码，适合6410嵌入式开发人员-6410 board-level development support package eboot source code, suitable for 6410 embedded developers
VMWare_BSP
- VMware 下的BSP板级支持包开发，一个例子-VMware under the BSP Board Support Package development, an example
6472csl
- ti最新DSP的芯片支持包，tms320c6472-csl ，寄存器层和应用层-ti the latest DSP chip support package, tms320c6472-csl, register layer and application layer
whatBSP_
- What is a Board Support Package?
mini2440-ce5-20100817
- 友善之臂2440开发板的WINCE 5.0的板级支持包-Kind of arm 2440 development board WINCE 5.0 Board Support Package