本研究项目针对手机、 M P4 等便携式电子产品对 I C芯片的高密度封装需求, 采用最新的国家发 明专利 ‘裸芯片积木式封装方法’, 将在同一块印制板上的集成电路裸芯片像积木一样挤紧嵌入在 PC B中, 用半导体光刻工艺进行芯片间以及芯片和 PC B间的直接平面互连, 完成电子整机板的制造过 程。 采用该方法可使电子整机芯片模板的体积缩小 5 到 20 倍。 本文对该项专利发明的研究内容、 技术 创新点、 工艺实施方案及典型应用等进行了较详细的介绍。-The research

Despite its highly adaptable and flexible nature, C++ is also one of the more complex programming languages to learn. Once mastered, however, it can help you organize and process information with amazing efficiency and quickness. The C++ Cookboo

Orca is an open-source framework for developing component-based robotic systems. It provides the means for defining and developing the building-blocks which can be pieced together to form arbitrarily complex robotic systems, from single vehicles to d

压缩包内提供了基于AVR、C51、STC和aeduino（电子积木）的BH1750芯片的光照强度测试代码。-Compression packages based the BH1750 chip AVR, C51, STC and aeduino (electronic building blocks) of the light intensity test code.