本文阐述了利用红外热像仪对电子设备关键部位进行热测试，检测电子设备内部温度分布情况，并与设计目标进行比较与纠正，从而达到最终目的-In this paper, using thermal infrared imager on the key parts of electronic equipment, thermal testing, testing the internal temperature distribution of electronic equipment, and compar